Senscomm Semiconductor

Senscomm Semiconductor is a fabless semiconductor company established in 2018, with its headquarters in Suzhou, China. The company was founded by industry veterans from Silicon Valley and South Korea, aiming to address the wireless connectivity market. The CEO is Michael Lee. Senscomm operates on a fabless business model, focusing on the design and development of system-on-a-chip (SoC) products while outsourcing the manufacturing process. This strategy allows the company to concentrate on its core competency: in-house research and development.

A key differentiator for Senscomm is its independent development of the entire chipset technology, including the core baseband (PHY/MAC) and radio frequency (RF) components. This contrasts with competitors who often license core Wi-Fi intellectual property from third parties. This self-reliance enables Senscomm to offer customized services and local support to its clients. The company is actively involved in the formulation and discussion of IEEE standards, positioning itself for future technological advancements like Wi-Fi 7. Its product portfolio is segmented into Station Wi-Fi for devices like TVs, notebooks, and IPCs; AIoT Wi-Fi for industrial applications; and AP Wi-Fi for routers and home gateways.

The company's offerings are centered around next-generation wireless standards. One of its key products is the WISEN-2, a highly integrated SoC that combines 2T2R dual-band Wi-Fi 6 and Bluetooth 5 on a single chip. This product is designed for high-performance wireless connectivity in consumer devices such as laptops, set-top boxes, and IP cameras. Features include data rates up to 1.2Gbps, support for DL/UL MU-MIMO and OFDMA, and backward compatibility with previous IEEE standards. The business targets the substantial Wi-Fi chip import substitution market in Mainland China and serves a global clientele.

Since its inception, Senscomm has achieved significant financial milestones, securing a total of $67.1 million over three funding rounds. The initial Series A funding occurred in November 2019. A subsequent Series A2 round in April 2022 raised over 300 million RMB (approximately $44.1 million), led by Ping An Overseas Holdings with participation from strategic investors like USI. These funds were allocated for the mass production of its Wi-Fi 6 chipsets and for developing and sampling its Wi-Fi 7 ready AP Router chipset. The company has established a global presence with subsidiaries in South Korea, the USA, Singapore, and Ireland to integrate international talent and resources.

Keywords: fabless semiconductor, Wi-Fi 6, Wi-Fi 7, system-on-a-chip, SoC, wireless connectivity, chipset design, baseband, radio frequency, RF, AIoT, AP Router, consumer electronics, telecom, Michael Lee, Suzhou, import substitution, IEEE standards, dual-band WLAN, Bluetooth 5, network communication, integrated circuits, connectivity chipsets