Jiangsu Silicon Integrity Semiconductor Technology (JSSI)

Jiangsu Silicon Integrity Semiconductor Technology (JSSI) operates in the semiconductor sector, providing mid- to high-end packaging and testing services. Established on September 11, 2020, the company is located in the Pukou Economic Development Zone in Nanjing, China. The management and R&D team possesses over 20 years of experience in the integrated circuit industry.

The company offers a comprehensive suite of services, including turnkey packaging and testing solutions primarily focused on mobile products. JSSI's technical capabilities encompass Bumping, Wafer-Level Chip Scale Package (WLCSP), Flip Chip packages (FCQFN, FCBGA), Quad Flat No-leads (QFN), Ball Grid Array (BGA), and System-in-Package (SiP), as well as advanced 2.5D/3D and Chiplet packaging. The business model revolves around providing these specialized manufacturing and design services to a global client base, covering everything from mask and laminate design to final testing. The company's initial phase involved a 54,000-square-meter standardized factory, with plans for a second phase to establish a larger packaging and test base of approximately 100,000 square meters.

Since its founding, JSSI has achieved several key milestones. By October 2020, its infrastructure, including clean rooms and logistics, was fully implemented, and its MES and SAP systems were online. The company began placing orders for essential equipment for Bumping, WLCSP, and QFN production in December 2020. JSSI is a funded company, with investors including Panorama Capital, Firstlight Capital, Xiaomi, and OPPO, among others. The company holds multiple certifications, such as ISO9001, ISO14001, and IATF16949, underscoring its commitment to quality management systems.

Keywords: semiconductor packaging, semiconductor testing, integrated circuit services, WLCSP, Flip Chip, System-in-Package, 2.5D packaging, 3D packaging, Chiplet, Bumping, turnkey semiconductor services, outsourced semiconductor assembly, OSAT, advanced packaging, back-end semiconductor manufacturing, Nanjing semiconductor, high-tech packaging, mobile product semiconductors, wafer-level packaging, Ball Grid Array, QFN packaging, semiconductor design services, electronics manufacturing