Ziptronix

Ziptronix operated as a pioneering force in the semiconductor industry, specializing in low-temperature direct bonding technologies for 3D integration. Founded in October 2000 as a venture-backed spinoff from RTI International, the company was established to commercialize revolutionary wafer and die bonding technologies. One of the co-founders, Paul Enquist, served as the Chief Technology Officer and was a key inventor of the company's core technologies. His extensive background in semiconductor technologies, including high-speed devices and 3D integration, was fundamental to the company's developments. The firm's business model centered on intellectual property licensing, providing its patented technologies to major semiconductor manufacturers.

Ziptronix developed two flagship technologies: ZiBond®, a direct oxide bonding process, and Direct Bond Interconnect (DBI®), which incorporates a copper-to-copper interconnect at the bond interface. These processes enable the vertical stacking of thinned, planar circuits, creating 3D integrated circuits (3D-ICs) without the need for adhesives. The key benefit of this low-temperature direct bonding is its ability to create robust, hermetically sealed bonds between semiconductor wafers or die, even those made from different materials, while preventing damage to the delicate circuitry. This method leads to significant advantages, including reduced device size, lower production costs, decreased power consumption, and enhanced system performance. The company's technology found significant commercial application in the manufacturing of CMOS image sensors, with Sony Corporation being a major licensee for its backside illuminated (BSI) sensors. The technology is also applicable to stacked memory, RF Front-End modules, MEMS devices, and FPGAs.

Over its history, Ziptronix raised over $30 million in venture capital from investors including Intersouth Partners, RTI International, and NC Idea. A significant milestone was the acquisition of the company in August 2015 by Tessera Technologies, Inc. (now part of Xperi) for approximately $39 million in cash. The acquisition was a strategic move by Tessera to expand its advanced packaging capabilities and accelerate the delivery of 2.5D and 3D-IC solutions to the semiconductor market. Following the acquisition, the Ziptronix team, including Paul Enquist, was retained to continue advancing the technology within Tessera's subsidiary, Invensas.

Keywords: direct bond interconnect, hybrid bonding, 3D integration, semiconductor packaging, ZiBond, DBI technology, wafer bonding, CMOS image sensors, 3D-IC, low-temperature bonding, semiconductor IP licensing, die-to-wafer bonding, wafer-to-wafer bonding, advanced packaging, RTI International spinoff, Paul Enquist, Tessera acquisition, Xperi, stacked memory, RF devices