Zhuhai Silicon Cool Technology

Zhuhai Silicon Cool Technology Co., Ltd. (SiliCool) operates as a specialized equipment manufacturer for the semiconductor and advanced electronics industries. The company directs its efforts towards the research, development, and production of high-precision automated packaging and testing equipment.

The firm was established on December 12, 2018, by Tang Yitao and Gao Xiang, who were classmates at the Hong Kong University of Science and Technology. Tang Yitao serves as the company's Chairman. The founders leveraged their background, which included prior work at a major international semiconductor equipment company, to launch SiliCool. They began their venture in Zhuhai's High-Tech Zone, taking advantage of local government support for startups from Hong Kong and Macao. The company initially focused on developing automated assembly equipment for high-end camera modules, successfully supplying major tech companies like Huawei.

Facing a slowdown in the smartphone market, SiliCool strategically pivoted, adapting its core high-precision bonding and alignment technologies for the rapidly expanding new energy vehicle (NEV) and semiconductor sectors. This transition proved successful, positioning the company as a key supplier in the domestic market. Its business model centers on the manufacturing and sale of specialized machinery to high-profile clients in power semiconductors, advanced packaging, optical communications, and consumer electronics. The company generates revenue through the direct sale of this equipment, which is often customized to meet specific client production requirements.

SiliCool's product portfolio includes solutions for advanced semiconductor packaging, addressing the post-Moore's Law era's focus on compact and efficient chip integration. A key offering is its Carbon-Silicide (SiC) silver sintering equipment, which has been adopted by major NEV manufacturers such as BYD, Li Auto, and Nio for their high-voltage platforms. The firm also produces a range of automated equipment, including IGBT module bonding machines and high-precision die attach (Bonder) equipment. These products are built upon the company's proprietary core motion control algorithms and high-precision alignment technologies, enabling them to compete with international equivalents on performance and cost-effectiveness.

Keywords: semiconductor equipment, advanced packaging, die bonding, silver sintering, power semiconductors, IGBT modules, carbon silicide, SiC devices, high-precision manufacturing, optical alignment, motion control algorithms, automotive electronics, NEV supply chain, hetero-integration packaging, electronic components manufacturing, automated optical inspection, optoelectronics, Tang Yitao, Gao Xiang, Zhuhai startup