
Zhongyin Microelectronics (Nanjing)
A hard-core interface IP technology supplier.
Date | Investors | Amount | Round |
---|---|---|---|
investor investor | €0.0 | round | |
investor investor investor | €0.0 | round | |
investor investor | €0.0 | round | |
* | CNY100m | Series B | |
Total Funding | 000k |
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Zhongyin Microelectronics (Nanjing) Co., Ltd., operating as Joinsilicon, is a semiconductor design services and product engineering company established in February 2021. The firm is strategically located in Nanjing, China, and has positioned itself as a key supplier of hard-core interface IP technology. The legal representative and chairman is Wang Hongpeng.
Joinsilicon provides a comprehensive suite of services that span from application software down to transistor-level layout in advanced technology nodes, including 6nm. The company's core business revolves around the independent research and development of high-end IP, IC design in advanced manufacturing processes, and the development of Chiplet architecture. Its business model is centered on offering one-stop high-end System-on-Chip (SoC) customization, advanced process IP, and Chiplet with advanced packaging products. This turnkey ASIC engagement model allows customers to benefit from co-developing hardware and software under a single roof.
The company serves a diverse client base in markets such as IoT security, servers, network communications, heterogeneous computing, and automotive chips. Key products include a 32G Multi-Protocol SerDes based on FinFET 12nm process technology, a versatile LPDDR5X/5/4X PHY IP, and an ONFI 5.1 IP for NAND Flash memory interfaces. Since its inception, Joinsilicon has secured significant funding, including a Series A round of over CNY 100 million in April 2023 and a Series B round in January 2024 from investors like SDIC Venture Capital Management. In 2023, the company reported sales of 200 million RMB and employed 300 people, with over 90% being technical personnel.
Keywords: semiconductor design services, interface IP, System-on-Chip, SoC customization, Chiplet, ASIC design, advanced packaging, FinFET, SerDes, LPDDR PHY, ONFI IP, IC design, IoT security chips, automotive chips, high-performance computing, data center solutions, custom silicon, product engineering, Nanjing semiconductor