Zhongan Semiconductor

Zhongan Semiconductor

A developer of semiconductor testing equipment, providing high-precision measurement solutions for quality control in semiconductor production.

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Established in March 2020, Zhongan Semiconductor is a developer of high-precision testing and measurement equipment for the semiconductor industry. The company, legally represented by Chen Jun, focuses on quality control for semiconductor materials. Its founding team possesses an average of 15 years of experience in advanced semiconductor equipment research and development. Zhongan Semiconductor operates on a business-to-business model, serving clients within the semiconductor manufacturing sector.

A significant milestone for the company was securing investment from the National Integrated Circuit Industry Investment Fund Phase II in early 2025. This backing, along with capital from investors like SINO-IC Capital and ZTE Capital, underscores the company's position within China's strategy to strengthen its domestic semiconductor supply chain. The company's initial funding included a Seed Round in June 2020, followed by a Series A round in January 2022. The company's registered capital was increased from approximately 52.46 million yuan to about 57.56 million yuan following the recent investment.

Zhongan Semiconductor's product portfolio is centered on wafer inspection and measurement tools. The company has developed equipment for inspecting the flatness and three-dimensional topography of both 200mm and 300mm wafers. Key product offerings include tools for wafer geometry measurement (such as bow, warp, and stress), un-patterned wafer particle inspection, thin-film thickness measurement, overlay measurement, and patterned wafer darkfield inspection. These products are based on the company's independently developed and patented equipment architecture system, highlighting a commitment to domestic intellectual property.

Keywords: semiconductor equipment, wafer inspection, metrology tools, wafer geometry, quality control, semiconductor testing, thin-film measurement, overlay measurement, 300mm wafer, National Integrated Circuit Industry Investment Fund, SINO-IC Capital, ZTE Capital, Chen Jun, deep tech, advanced manufacturing, semiconductor supply chain, domestic intellectual property, particle inspection, wafer flatness, wafer warpage

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