Suzhou Yimai Semiconductor Technology
Manufacturer of advanced packaging substrate technology.
| Date | Investors | Amount | Round |
|---|---|---|---|
| investor investor investor | €0.0 | round | |
| investor | €0.0 | round | |
* | N/A | Seed | |
| Total Funding | 000k | ||
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Suzhou Yimai Semiconductor Technology (EMC) is a specialized manufacturer of advanced substrates for the semiconductor industry. The company concentrates on the development and mass production of sophisticated packaging substrate technology crucial for sectors such as the Internet of Things (IoT), automotive, and artificial intelligence.
Positioned within the electrical equipment and industrial supplies sectors, EMC operates on a venture capital-backed, privately held ownership model. The company's business revolves around providing semiconductor producers with essential components, thereby generating revenue through the sale of these advanced substrates. Its headquarters are located in Suzhou, China, a significant hub for the nation's technology and manufacturing industries.
Since its inception, EMC has progressed through several funding stages. The company secured a significant seed round on April 10, 2023, raising $14.5 million. This was followed by two subsequent early-stage venture capital rounds on March 25, 2024, and January 3, 2025, indicating a consistent trajectory of growth and investor confidence. The company is currently in a revenue-generating stage. Key investors include Haitong Fortis Private Equity, Co-Win Ventures, and FutureX Capital, among others.
The core of EMC's offering is the production of advanced packaging substrates. These components are fundamental to modern electronics, enabling the creation of smaller, more efficient, and more powerful semiconductor devices. By focusing on high-growth technology fields, the company aligns its product development with the increasing demand for specialized semiconductor solutions in a variety of high-tech applications.
Keywords: advanced substrates, semiconductor packaging, substrate technology, IoT components, automotive semiconductors, AI hardware, electrical equipment manufacturing, industrial supplies, venture capital-backed, high-tech manufacturing, semiconductor components, advanced packaging, Haitong Fortis Private Equity, Co-Win Ventures, FutureX Capital, Suzhou technology