XMC

Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. (XMC) is a Chinese semiconductor manufacturer established in 2006. The company operates as a subsidiary of Yangtze Memory Technologies (YMTC) and is a key contributor to its 3D NAND memory production. XMC was originally founded by the Wuhan Government and later managed by Semiconductor Manufacturing International Corporation (SMIC) following a joint investment in 2010. By 2013, XMC became an independent entity, shifting its focus from general foundry services to the production of flash memory. A significant milestone occurred in July 2016 when Tsinghua Unigroup acquired a majority stake.

XMC functions as a 12-inch wafer foundry, specializing in 3D IC, digital & analog, and specialty memory technologies. It delivers a range of semiconductor wafer foundry services across different technology nodes and process platforms, supported by two mass-production fabs. The company's business model is centered on providing these foundry services, along with support services like Multi-Project Wafer (MPW) and photomask services, to a global clientele. Its products are utilized in various downstream sectors, including automotive electronics, industrial control, consumer electronics, and computers. Revenue is generated from these foundry and related services, catering to enterprises within the semiconductor industry chain. In March 2024, it was reported that XMC had started a project to develop and manufacture High Bandwidth Memory (HBM). The company filed for an initial public offering (IPO) on the Shanghai Stock Exchange STAR Market in May 2024, which was approved in September 2024.

The company's offerings include its proprietary SPI NOR Flash products, built on its 50nm Floating Gate NOR Flash process technology. A key differentiator is its 3DLink™ technology platform for three-dimensional wafer stacking, which enables the vertical connection of multiple wafers or chips to reduce chip area, shorten connection distances, and improve speed and bandwidth. This platform includes S-stacking® (two-wafer stacking), M-stacking® (multi-wafer stacking), and Hi-stacking® (heterogeneous integration) technologies. These technologies provide solutions for sensors, in-memory computing, high-speed computing, and high-bandwidth memory. XMC has obtained several quality management certifications, including IATF16949 and ISO9001.

Keywords: semiconductor manufacturing, wafer foundry, 3D NAND, NOR Flash, 3D IC, specialty memory, automotive electronics, integrated device manufacturer, Yangtze Memory Technologies, Tsinghua Unigroup, 12-inch wafer, foundry services, High Bandwidth Memory, 3DLink, wafer stacking, SPI NOR Flash, semiconductor R&D, advanced specialty process, digital & analog platform, MPW service