Xinpu Technology

Established in Shanghai in November 2018, Xinpu Technology (Xinpletek) is a fabless semiconductor company focused on the radio frequency (RF) front-end market. The firm designs and develops high-performance RF front-end modules, which are critical components for wireless communication in mobile devices and infrastructure. Its product portfolio serves the 4G/5G cellular and Wi-Fi 6 standards, with applications in smartphones, Internet of Things (IoT) modules, routers, and other smart terminals.

The company was founded by Shi Ying and Gu Jianzhong. Shi Ying, the company's Chairman and General Manager, previously worked at Skyworks, a major American semiconductor company, including leading its Silicon Valley R&D center. This experience in a leading global RF firm provided a foundation in developing and mass-producing RF modules on a large scale. Co-founder Gu Jianzhong holds a bachelor's degree from Tsinghua University and a Ph.D. from the Shanghai Institute of Microsystems and Information Technology, bringing extensive experience in RF front-end chip research and development.

Xinpu Technology operates on a business model centered around designing proprietary RF solutions and supplying them to high-volume manufacturers. Its core products include Power Amplifiers (PA), Low Noise Amplifiers (LNA), switches, and filters, which are offered as integrated modules. A key differentiator is the company's ability to develop all major components of its 5G solutions in-house. The firm has successfully supplied products to major clients, including handset maker OPPO and leading IoT module manufacturers like Quectel and Fibocom. By 2024, its first-generation product series had achieved shipments of 200 million units, and the company introduced a compact 3x3mm 5G RF front-end solution aimed at addressing the space constraints in modern electronics.

The company has secured significant financial backing through multiple funding rounds. Its journey began with an angel round in July 2019, followed by Pre-A, A, B, and A++ rounds through December 2021 and beyond. Investors include prominent venture capital firms such as Northern Light Venture Capital, HUA Capital, and Lenovo Star. This consistent attraction of capital underscores investor confidence in the company's technical capabilities and market position within the competitive semiconductor industry.

Keywords: RF front-end, 5G cellular, Wi-Fi 6, semiconductor, fabless, Power Amplifier (PA) modules, LNA, RF switch, IoT modules, smartphone components, chip design, XinpleTek, Shi Ying, Gu Jianzhong, radio frequency solutions, 4G LTE, wireless communication, mobile terminals, RFIC, integrated circuits, Quectel, Fibocom, OPPO