Wuhan Qianmu Laser
Semiconductor laser chips for AI, robotics and manufacturing.
| Date | Investors | Amount | Round |
|---|---|---|---|
* | N/A | Early VC | |
| Total Funding | 000k | ||
Wuhan Qianmu Laser, also known as Xuzhou Qianmu Technology Group, is a semiconductor company founded in 2017 that designs, produces, and manufactures laser chips. The firm, co-founded by R&D Director Xu Yang, provides high-power vertical-cavity surface-emitting lasers (VCSEL), edge-emitting lasers, and distributed feedback (DFB) laser devices. Its business model covers the entire production process from chip layout design and process integration to high-volume fabrication and sales.
Qianmu Laser has established a product portfolio that includes VCSEL 3DS chips, data communication VCSEL chips, silicon optical CW light source chips, and high-power pump source chips. These products serve high-growth industries such as AI, robotics, high-end manufacturing, 3D sensing, and optical communications. The company operates on a venture capital-backed, privately held model and generates revenue through the sale of its specialized laser chip products to industrial users. Clients for its 3C consumer, IDC data communication, and high-end manufacturing solutions include several leading companies in those sectors.
The company was founded in Wuhan in 2017, securing 30 million yuan in angel financing. By 2018, it launched its first-generation 3D sensing chip. A US subsidiary was established in 2019, the same year it completed a 50 million yuan pre-A financing round. Significant milestones include shipping its 3D sensing chips in bulk to a major customer's core supply chain in 2020, and securing 50 million yuan in a Series A+ round in 2021. In 2023, the company obtained Series B financing and initiated the construction of an IDM (Integrated Device Manufacturer) model. In 2024, the company was renamed "Xuzhou Qianmu Group" and was listed as a potential unicorn in Jiangsu Province after delivering over 30 million chips.
Keywords: semiconductor lasers, VCSEL, edge-emitting laser, distributed feedback laser, optoelectronics, laser chip design, 3D sensing, optical communications, AI data centers, industrial lasers, high-power lasers, silicon photonics, gallium arsenide, laser fabrication, chip manufacturing