TransDimension
TransDimension products will expand on this base, leveraging our expertise in embedded systems connectivity.
| Date | Investors | Amount | Round |
|---|---|---|---|
| investor | €0.0 | round | |
| investor | €0.0 | round | |
| investor investor investor investor | €0.0 | round | |
N/A | Acquisition | ||
| Total Funding | 000k | ||
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TransDimension Inc. was established in 1997 by founder Ping Liang. The company operated as a fabless semiconductor firm, focusing on the development and provision of Universal Serial Bus (USB) connectivity solutions for a wide range of embedded applications. Its product lines were comprehensive, including integrated circuits (ICs), intellectual property (IP) cores, and specialized software stacks, such as the notable SoftConnex USB software. This suite of products enabled direct connectivity between various PC peripherals and mobile devices.
The company catered to the consumer electronics, storage, audio, and add-on card markets. Its technology was implemented in diverse products like cellular phones, printers, digital cameras, PDAs, and portable storage devices. The business model centered on providing these hardware and software components to manufacturers of electronic devices. In a strategic move to enhance its software capabilities, TransDimension acquired SoftConnex Technologies Inc., integrating its embedded software solutions. Throughout its operation, the company secured significant venture capital funding, raising a total of $31.4 million over several rounds from investors including Shelter Capital Partners, VantagePoint Capital Partners, and iSherpa Capital.
A significant milestone in the company's history was its acquisition by Oxford Semiconductor on October 5, 2005. This acquisition was a strategic move by Oxford to merge its FireWire expertise with TransDimension's USB technology, aiming to become a dominant supplier of complete connectivity solutions. Following the acquisition, TransDimension's product portfolio was integrated as one of four product lines within Oxford Semiconductor, and the company was rebranded under the Oxford name. Rick Goerner, who was the President and CEO of TransDimension, transitioned to the role of Senior Vice President of Sales and Marketing at Oxford Semiconductor.
Keywords: USB connectivity, embedded systems, integrated circuits, IP cores, fabless semiconductor, consumer electronics, mobile devices, PC peripherals, connectivity solutions, SoftConnex, Oxford Semiconductor, Ping Liang, Rick Goerner, venture capital, semiconductor industry, hardware, software stacks, FireWire, M&A