Teyan Semiconductor
A rare semiconductor advanced packaging equipment company in China.
| Date | Investors | Amount | Round |
|---|---|---|---|
| investor | €0.0 | round | |
* | CNY20.0m | Series B | |
| Total Funding | 000k | ||
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Founded in 2017 and headquartered in Shenzhen, China, Teyan Semiconductor operates as a manufacturer of semiconductor and precision industrial laser equipment. The company, formerly known as Shenzhen Taiyan Optoelectronics Co., Ltd., is privately held and backed by venture capital.
Teyan Semiconductor provides solutions for the advanced package sector of the semiconductor industry. The company's self-developed equipment includes laser, plasma, and sputter series, with the mechanical design, electrical design, and software control systems all being developed in-house. These products can be utilized in advanced packaging applications such as System-in-Package (SiP), Fanout, Chiplet, and 2.5D/3D packages. Specific equipment offerings include laser marking, cutting, grooving, drilling, and de-flash machines, as well as plasma cleaning and sputtering equipment. The company's products serve the high-end manufacturing customer market within the semiconductor industry, with its equipment being used in mass production by global IC manufacturers.
The firm's business model involves providing customized process and equipment solutions to meet specific client needs. Teyan Semiconductor collaborates with clients to develop new processes, aided by their modularly designed equipment that offers adaptability for various production requirements. They also offer turnkey production line solutions for SiP and RFID products, which encompasses production line planning, process formulation, and equipment selection. The company has secured $7.02 million in funding, with a Series B round in January 2024 raising $7.02M. Key investors include Plum Ventures, Vinno Capital, and Goldport Capital. Keywords: semiconductor equipment, advanced packaging, laser processing, plasma systems, sputtering equipment, SiP solutions, Fanout technology, Chiplet manufacturing, 2.5D packaging, 3D packaging, precision industrial lasers, laser marking, laser cutting, plasma cleaning, semiconductor manufacturing, turnkey production lines, RFID production, process development, IC packaging, Shenzhen Taiyan Optoelectronics