
SyChip
And markets radio frequency integrated circuits and chip scale modules for the wireless internet appliance market.
Date | Investors | Amount | Round |
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- | investor | €0.0 | round |
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investor investor investor investor investor investor investor | €0.0 Valuation: €0.0 | round | |
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N/A | N/A | Acquisition | |
Total Funding | 000k |














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SyChip, Inc. operated as a designer and marketer of Radio Frequency Integrated Circuits (RFIC) and Chip Scale Modules (CSM) tailored for the wireless internet appliance market. The company was established on October 1, 1999, originating as a spin-out from Lucent Technologies Inc.'s New Ventures Group. Key figures in its inception include Dennis Peasenell, who served as the initial President and CEO, and King Tai, a Bell Labs fellow who became the Chief Technical Officer and developed the core packaging technologies. A Shanghai-based subsidiary was founded in 2000 by Moses Asom.
The firm concentrated on developing highly integrated RF modules, leveraging proprietary integration methods, modular architectures, and low-loss silicon technologies. This approach aimed to make RF designs more predictable and easier to simulate, which in turn was expected to shorten time-to-market for their clients' products while boosting performance and reliability. SyChip’s product strategy involved offering integrated RF devices in flip-chip packages that combined memory, analog, and digital functions. These modules were designed to be compliant with prevailing wireless standards such as GPS, 3G, GPRS, and Bluetooth, targeting manufacturers of cellular phones, personal digital assistants (PDAs), and laptop computers.
Initial funding came from Lucent and APack Technologies Inc., a Taiwanese packaging and foundry company that also served as an early production partner. SyChip was a venture-backed company, attracting investments from firms like Austin Ventures, 3i Group, and Sierra Ventures. The company's business model revolved around providing these advanced wireless modules to a broad set of customers needing to integrate wireless functionalities into their electronic devices. On April 17, 2006, SyChip was acquired by Murata Manufacturing Co., Ltd., a major supplier of passive electronic components, for approximately $140 million. The acquisition was intended to combine Murata's resources and global sales force with SyChip's design expertise and entrepreneurial approach to serve a wider customer base seeking integrated wireless modules for functionalities like GPS, WiFi, WiMAX, and mobile TV. All SyChip employees were expected to join Murata following the acquisition.
Keywords: radio frequency integrated circuits, RFIC, chip scale modules, CSM, wireless internet appliances, RF modules, Lucent spin-off, Bell Labs, wireless connectivity, wireless telecommunication, Murata Manufacturing, integrated wireless modules, flip-chip packages, silicon substrate, wireless LAN, GPS, 3G, GPRS, Bluetooth, semiconductor