Zhejiang Xingyao Semiconductor

Zhejiang Xingyao Semiconductor Co., Ltd., formerly known as Zhejiang XintangZhixin Technology, was established in November 2020. The company was founded by a team led by experts from the National Overseas Talent Introduction Plan and the Zhejiang Kunpeng Action Plan. The chairman is Anming Gao. The core research and development team comprises graduates from well-known universities who have extensive experience at top international RF filter and chip companies such as Qualcomm, Apple, Qorvo, Skyworks, and TDK.

The company is a high-tech enterprise focused on the research, development, production, and sales of radio frequency (RF) filter chips and front-end modules. It operates in the semiconductor market, providing critical components for 5G communications, the Internet of Things (IoT), and automotive applications. Its business model involves designing, manufacturing, and selling these components to a client base that includes major mobile phone manufacturers like Samsung, Honor, Huawei, OPPO, and VIVO. The company has successfully transitioned from a fabless (without a fabrication plant) model to an Integrated Device Manufacturer (IDM) model with the launch of its own wafer fabrication line, giving it end-to-end capabilities in R&D, design, manufacturing, packaging, and testing.

Xingyao Semiconductor's product portfolio is centered around RF front-end solutions based on SAW (Surface Acoustic Wave), TC-SAW, and BAW (Bulk Acoustic Wave) technologies. The company produces a range of high-performance RF filter chips, duplexers, quadruplexers, and RF front-end modules such as DiFEM, L-DiFEM, and L-PAMiF. These products are used in smartphones, communication modules, smart homes, base station routing, and virtual reality devices. A significant achievement was the release of the world's smallest discrete duplexer chips in July 2024. The company has also developed automotive-grade Wi-Fi filters and plans to release 5G LFEM receiver and transmitter modules. Significant milestones include a Series B funding round of CNY 1 billion in June 2024 and the launch of its 5G RF filter chip wafer production line in December 2024, a project with a total investment of CNY 750 million.

Keywords: RF front-end, semiconductor, filter chips, RF modules, SAW technology, BAW technology, 5G communication, Internet of Things, duplexers, quadruplexers, Anming Gao, integrated device manufacturer, wafer fabrication, mobile communication, automotive electronics, fabless to IDM, RF filter manufacturing, China Mobile investment, high-performance filters, wireless communication components