
SMIC Thermal Power Technology
Colloidal quantum dot short-wave infrared detector chips.
Date | Investors | Amount | Round |
---|---|---|---|
* | N/A | Series B | |
Total Funding | 000k |
SMIC Thermal Power Technology (Beijing) Co., Ltd., also known as Zhongxin Rencheng, is a technology company established on March 8, 2021. The company focuses on developing and producing short-wave infrared cameras utilizing proprietary quantum dot focal plane array devices. Its core technology revolves around colloidal quantum dot infrared detector chips, which offer a breakthrough from the manufacturing process limitations of traditional bulk semiconductors. The quantum dot material's "quantum confinement" effect allows for precise wavelength adjustment across a broad spectrum simply by controlling the size. This capability surpasses the 1.7-micron limit of conventional short-wave infrared devices and enables high-sensitivity imaging at room temperature in various wavebands, including 0.8-1.7 microns and 0.8-2.2 microns.
The company's products are aimed at several markets, including industrial inspection, photoelectric pods, laser detection, wafer inspection, and smart agriculture. The technology also has applications in autonomous driving systems, enabling vehicles to "see" pedestrians and react in challenging conditions such as darkness, fog, or glare. In early 2023, SMIC Thermal Power Technology secured tens of millions of yuan in a Pre-A financing round from investors including Founder Hesen, Yiyuan Aerospace, Longding Investment, and Taiyou Fund. The capital was allocated for the research, development, and production line construction of its colloidal quantum dot infrared detector chips and modules. The company has been recognized as a national high-tech enterprise and a technology-based small and medium-sized enterprise in China.
Keywords: colloidal quantum dots, short-wave infrared cameras, infrared detector chips, SWIR imaging, quantum dot technology, focal plane array, industrial inspection, autonomous driving sensors, wafer inspection, smart agriculture technology, photoelectric pods, spectral analysis, semiconductor technology, high-tech enterprise.