Shenzhen Gencun Technology

Shenzhen Gencun Technology, operating as smartnvy, is a semiconductor company based in Shenzhen, China, that develops and sells MRAM (Magnetoresistive Random-Access Memory) chips and ultra-low power AI System-on-Chips (SoCs). The firm's core technology leverages the principles of reading magnetic resistance to create next-generation non-volatile memory, which aims to reduce overall power consumption and system Bill of Materials (BOM) cost while enhancing reliability for electronic devices.

The company's product portfolio is structured into three main categories. The first is Standalone MRAM, available in serial and parallel interface options. The second is Ultra-Low Power SoCs, exemplified by its CY series. The third is AI Inference SoCs, such as the JM series, which are designed for on-device voice AI inference solutions and feature multiple high-performance RISC-V CPUs and a Neural Processing Unit (NPU).

Smartnvy serves a diverse client base across several high-growth markets. In consumer electronics, it provides low-power, intelligent single-chip solutions for applications like wearables and mobile devices to help clients reduce costs and speed up time-to-market. For the Internet of Things (IoT) sector, the company offers solutions that enable long standby times and intelligence for battery-powered devices. Additionally, smartnvy supplies highly reliable and durable control, computing, and storage chips for the industrial and automotive sectors, meeting the stringent requirements of these industries.

The company operates on a business-to-business (B2B) model, generating revenue through the sale of its semiconductor chips to manufacturers and other businesses in its target markets. As a privately held entity, Shenzhen Gencun Technology has attracted backing from several investors, including China Zhongji Investment, Giantec Semiconductor, Hongshan Capital Group, Baidu Ventures, and Shenzhen Gaoxin Investment.

Keywords: MRAM, semiconductor, AI SoC, ultra-low power, System-on-Chip, non-volatile memory, RISC-V, NPU, AI inference, consumer electronics, Internet of Things, IoT, industrial automation, automotive electronics, chip design, memory chips, magnetic resistance, embedded systems, wearables, smart devices