Shenzhen Xister Technology
Offers high-end abrasive products and system solutions for precision cutting, grinding, drilling, and polishing in semiconductor, automotive, and other industries.
| Date | Investors | Amount | Round |
|---|---|---|---|
* | CNY20.0m | Series A | |
| Total Funding | 000k | ||
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From a financial analyst's perspective, Shenzhen Xister Technology represents a specialized and critical player within the global semiconductor value chain. Established in October 2015, the company has positioned itself as a key supplier of high-end abrasive products and comprehensive system solutions. Its business is centered on enabling the high-precision manufacturing processes that are fundamental to the semiconductor industry.
The company's core operations involve the development and provision of advanced materials and machinery for cutting, grinding, drilling, and polishing. These are not commodity products but rather highly engineered solutions tailored for clients in the semiconductor fabrication sector. The precision required in creating silicon wafers and integrated circuits means that the quality of these abrasive processes directly impacts chip yield, performance, and reliability. Shenzhen Xister Technology addresses this by offering integrated systems that ensure consistency and ultra-fine tolerances, which are essential for producing next-generation electronics.
The business model appears to be B2B, focusing on supplying to semiconductor foundries, integrated device manufacturers (IDMs), and other related high-tech manufacturing firms. Revenue is likely generated through the sale of its proprietary abrasive materials, consumables, and the sophisticated grinding and polishing equipment it develops. The company's strategic importance is underscored by its backing from investment firms such as Haitong-Fortis Private Equity Fund Management and Zhongguancun Collaborative Innovation Fund, signaling confidence in its technology and market position within a highly competitive and capital-intensive industry.
Keywords: semiconductor manufacturing, abrasive solutions, precision grinding, wafer polishing, silicon cutting, CMP, semiconductor materials, high-tech fabrication, integrated circuit production, electronics manufacturing, deep tech, advanced materials, industrial technology, precision engineering, lapping and polishing, venture capital backed, wafer fabrication