Shenzhen Dewo Advanced Automation

Shenzhen Dewo Advanced Automation Co., Ltd. (DAA) operates as a specialized manufacturer of high-end equipment for the semiconductor packaging and testing industry. Established in 2012 and headquartered in Shenzhen, the company focuses its resources on the independent research, development, production, and sales of machinery crucial for semiconductor manufacturing. The firm's chairman, Xiong Liwen, holds a master's degree from Harbin Institute of Technology and has a professional background that includes scientific research at his alma mater, a role at Huawei Electric, and co-founding Huichuan Technology. This experience has embedded a strong R&D management culture within DAA.

DAA's product portfolio is centered on providing stable, high-speed, and high-precision equipment. Key products include high-speed planar wire bonding machines, die bonding machines, sorting machines, and other precision microelectronic equipment. The company serves clients within the LED lighting, display packaging, and IC semiconductor packaging sectors. Revenue is generated through the direct sale of this specialized equipment. The company's business model is predicated on addressing the growing demand for semiconductor packaging equipment, particularly within mainland China, which represents a significant market. By offering a domestic alternative to international suppliers, DAA targets both large industry leaders seeking supply chain security and cost-effective solutions, as well as small and medium-sized enterprises that are more cost-sensitive.

A significant portion of the company's efforts is directed towards technological advancement, with over 50% of its employees being R&D technicians and R&D investment accounting for 20% of revenue. This has resulted in a substantial intellectual property portfolio, with over 70 core independent patents. DAA has independently developed critical systems such as a trajectory ultra-high-speed synchronous motion control system, proprietary vision algorithms, and ultra-high-speed motor and drive algorithms. These technological capabilities allow their automatic high-speed gold wire machines to be competitive in speed, accuracy, and stability with leading global enterprises. The company's commitment to R&D and market focus has led to several accolades, including being named to Deloitte's 2023 High-Growth Technology 20 list in Shenzhen.

Keywords: semiconductor packaging equipment, die bonding machines, wire bonding machines, precision microelectronics, semiconductor manufacturing, automation equipment, high-speed synchronous motion control, machine vision algorithms, LED packaging, IC semiconductor packaging, testing equipment, Shenzhen technology, advanced manufacturing, electronic equipment, high-precision machinery, Chinese semiconductor industry, automation solutions, industrial machinery, electronic components manufacturing, technology hardware