Heyan Technology

Shenyang Heyan Technology Co., Ltd., established in January 2011, is a Chinese company specializing in the research, development, and manufacturing of high-precision equipment for the semiconductor industry. The company's technical team originates from China's first national project team to develop and produce precision dicing machines.

Heyan Technology manufactures and sells a range of specialized machinery, including precision dicing saws, wafer tape mounters, wafer expanders, UV irradiation machines, and wafer cleaning machines. They also provide related supplies such as blades, chucks, UV films, and spindles. Their product portfolio features over 15 models of dicing solutions, including semi-automatic and fully automatic machines for various wafer sizes, as well as back-thinning grinders. These products are used by semiconductor OSAT companies, wafer fabs, LED fabs, and manufacturers of power discretes and MEMS devices.

The company's business model revolves around selling this equipment and providing comprehensive support services. They operate a complete process laboratory with professional cutting engineers to develop efficient cutting solutions for clients. As of 2022, Heyan Technology has delivered over 4,500 dicing saws to more than 600 clients worldwide. The company is headquartered in Shenyang, China, and has expanded its presence with offices in East, South, Southeast, and Southwest China, along with a research and development service center in Suzhou and two authorized agents in overseas markets.

Keywords: semiconductor equipment, precision dicing machine, wafer processing, dicing saw, wafer grinding, silicon wafer cutting, back grinding, wafer tape mounter, wafer cleaning machine, semiconductor manufacturing, dicing and grinding, semiconductor packaging, OSAT, wafer fabs, LED manufacturing, MEMS devices, precision machinery, cutting process solutions, automatic dicing saw, back thinning grinder