Shanghai Gongjin Microelectronics Technology

Shanghai Gongjin Microelectronics Technology Co., Ltd. (Gongjin Microelectronics) is a technology company established in December 2021 that specializes in advanced packaging and testing for intelligent sensors and automotive electronic chips. The company was founded by Shenzhen Gongjin Electronics Co., Ltd. (603118.SS), Probe Intelligent Sensing Fund, and a technical and management team. Its legal representative and General Manager is Zhang Wenyuan.

Gongjin Microelectronics provides a one-stop solution for clients such as Fabless, Design House, and IDM, integrating R&D, engineering, and mass production. The company's main services include packaging, calibration and testing, and reliability verification. The packaging services cover a complete line from wafer grinding and dicing to various front-end and back-end processes, supporting package types like LGA, QFN, Fan-out, and SiP. Its testing capabilities encompass wafer, CSP, and finished product tests for a wide range of sensors, including inertial, pressure, magnetic, environmental, acoustic, and optical sensors.

The company operates a research and development center in Shanghai and a 24,000-square-meter production base in Taicang, Jiangsu, which includes 10,000 square meters of clean rooms. Gongjin Microelectronics holds several quality certifications, including ISO 9001, ISO 14001, and IATF 16949 for automotive quality management. The firm has received strategic investments, including an angel round in December 2021 and a RMB 100 million strategic investment in June 2024 from investors like Probe Capital and Sensing Investment.

Keywords: sensor packaging, sensor testing, automotive electronics, MEMS packaging, integrated device manufacturer, fabless, one-stop solution, wafer testing, chip packaging, calibration services, reliability testing, LGA packaging, QFN packaging, SiP packaging, automotive sensors, advanced packaging