SCP Global Technologies

Established in 1973 in Silicon Valley as Santa Clara Plastics, SCP Global Technologies carved out a niche as a custom machine shop before relocating to Boise, Idaho, in 1978. The firm focuses on the semiconductor industry, providing surface preparation technology, systems, and services. Its business model centers on developing, manufacturing, and supporting automated wet process tools designed to improve yield, quality, and throughput for semiconductor manufacturers in high-throughput environments. A significant milestone was the 1984 introduction of the industry's first fully automated, dry-to-dry robotic wet processing system, which solidified its market position.

The company's product line consists of advanced surface preparation solutions, including wet processing equipment for semiconductor wafers. It holds patents for single wafer drying technologies such as Marangoni®, GreenDry®, and GreenDry CI™ (Chemical Inject). The fully-automated ECLIPSE 300™ is one of its notable products, offering a solution for 300mm surface preparation requirements. To reflect its international focus, the company changed its name from Santa Clara Plastics to SCP Global Technologies in 1996. The company's client base includes major players in the semiconductor sector, and it operates a global customer support network with service and parts distribution centers in the United States, Europe, and Asia.

In March 2003, after 28 years in business, the company secured its first round of venture capital, raising $50 million from 3i and VantagePoint Venture Partners. This funding was partly used to acquire the Wet Products Division of Mattson Technology, Inc. Subsequently, in September 2006, Akrion Inc. entered into an agreement to acquire most of the assets and selected liabilities of SCP Global Technologies, aiming to expand its own wafer cleaning offerings. Prior to this, in 2005, Applied Materials Inc. had acquired SCP's single-wafer, HF-last immersion technology and Marangoni clean/dry intellectual property.

Keywords: semiconductor equipment, surface preparation, wet processing, wafer cleaning, automated robotic systems, semiconductor manufacturing, dry-to-dry processing, Marangoni drying, GreenDry, single wafer drying, batch-immersion tools, semiconductor capital equipment, surface preparation technology, automated wet process tools, 300mm surface preparation, wafer drying technologies