Qingdao Zhongwei Chuangxin Electronics

Qingdao Zhongwei Chuangxin Electronics, legally known as Qingdao Zhongwei Chuangxin Electronics Co., Ltd., is a high-tech enterprise established in 2016. The company focuses on the development of new power semiconductor devices.

The Chairman, Kong Liang, hails from the Institute of Electrical Engineering at the Chinese Academy of Sciences and brings extensive experience in power semiconductor module design, packaging, and testing, having contributed to the formulation of several industry standards. The core team comprises individuals from the Chinese Academy of Sciences and other prominent companies in the sector, each with over a decade of experience in areas like power semiconductor device packaging, application research and development, and IGBT and SiC technology.

The company's core business involves the technical development, design, manufacturing, and sales of chip products such as IGBTs (Insulated Gate Bipolar Transistors), SiC (Silicon Carbide), and advanced Intelligent Power Modules (IPM). It operates on a Virtual-IDM (Integrated Device Manufacturer) model, forming strategic partnerships with top-tier domestic foundries to secure production capacity. Revenue is generated through the sale of these semiconductor components and by providing system application solutions to its clients.

Zhongwei Chuangxin serves a diverse client base across several key industries, including industrial frequency conversion, new energy vehicles, renewable power generation, energy storage, and white goods appliances. The firm's product portfolio is extensive, featuring IGBT modules, IPMs, PIM modules, and various types of MOSFETs and diodes. A key offering is their Intelligent Power Module (IPM), a highly integrated component that combines crucial power devices with control and protection circuits, enabling more efficient and compact solutions for motor control in appliances, industrial machinery, and new energy vehicles. The company has mastered 7th generation IGBT chip design technology and possesses advanced IPM packaging and testing technology. Their IGBT products, which utilize Trench Field-Stop (TFS) technology, are available in 600V, 1200V, and 1700V series, catering to a wide range of applications.

Keywords: power semiconductors, IGBT modules, Intelligent Power Modules (IPM), SiC chips, MOSFET, power electronics, semiconductor design, new energy vehicles, industrial inverters, energy storage, white goods appliances, Virtual-IDM, Trench Field-Stop, power device, motor control, renewable energy components, Kong Liang, Chinese Academy of Sciences, Qingdao semiconductor