Original Grain (Beijing) Semiconductor Technology
AI Chiplet provider for flexible, multimodal LLM computing.
| Date | Investors | Amount | Round |
|---|---|---|---|
* | N/A | Seed | |
| Total Funding | 000k | ||
Original Grain (Beijing) Semiconductor Technology Co., Ltd., also known as Calculet, is an AI Chiplet computing power chip company founded in April 2023. The company was established by CEO Dr. Fang Shaoxia and co-founder Yuan Gang, both alumni of Tsinghua University's Department of Electronic Engineering with extensive experience in the semiconductor industry. Dr. Fang has over a decade of experience in high-performance processor architecture and SoC chip development, while Yuan Gang has over 20 years of experience in the integrated circuit field. The founding team is composed of professionals from major international semiconductor companies.
The firm specializes in developing general-purpose AI Chiplets to provide flexible computing power for deploying large multimodal models at the edge, cloud, and end devices. Its business model revolves around providing high-energy-efficiency, low-cost AI Chiplet components and toolchains. This allows clients, such as SoC and system manufacturers, to quickly configure AI chips with different computing power specifications based on their business needs. The company's product lineup includes large model inference acceleration cards and edge large model computing power modules, with options for customized computing power. This approach addresses the increasing demand for high-performance, cost-effective computing power driven by the rise of large AI models.
Original Grain's core technologies include CalCore, a multimodal AI computing core design; CalFusion, an AI computing power fusion technology that allows for stacking and expanding multiple AI chiplets; and CalSpeed, a software framework for efficient AI algorithm deployment. The company has received significant financial backing, securing a seed round of several tens of millions of RMB in June 2023 from investors including Inno Angel Fund, Zhongguancun Development Group, and Tsinghua Alumni Seed Fund. In April 2024, it announced another financing round led by YIWEI Ventures and Huafeng Group, with previous investors also participating, to fund large model AI Chiplet R&D and business expansion.
Keywords: AI Chiplet, semiconductor, large language models, multimodal AI, edge computing, processor architecture, system-on-a-chip, computing power solutions, integrated circuits, CalCore, CalFusion, CalSpeed, AI acceleration, machine learning hardware, custom silicon, fabless semiconductor, data center acceleration, AI inference, deep learning processors, neural network processors