NovoLINC

NovoLINC is a thermal technology company established in 2024 and headquartered in Pittsburgh, PA. The company originated as a spin-out from Carnegie Mellon University, founded by a team that includes CEO Dr. Ning Li, Chief Science Officer Professor Sheng Shen, and Chief Technology Officer Dr. Rui Cheng. The founding team identified a critical bottleneck in the electronics industry: as the power of components like CPUs and GPUs escalates, traditional thermal interface materials (TIMs) are failing to provide adequate heat dissipation.

The company develops and manufactures advanced thermal interface materials designed to manage heat in high-performance applications. NovoLINC's core product is a nanocomposite material that addresses the thermal challenges posed by next-generation electronics. Its technology utilizes a proprietary manufacturing process to create a unique nanostructured materials system based on vertically aligned copper nanostructures and a central heat spreader. This design facilitates efficient heat transfer both vertically and horizontally. A key performance metric is its ability to reduce thermal resistance to below 1 mm²·K/W, a significant improvement over the 10 to 200 mm²·K/W typical of conventional solutions. The material is designed for scalability, using a roll-to-roll manufacturing process with widely available materials, and is compatible with existing industry standards.

NovoLINC's business model is centered on supplying its thermal interface solutions to companies in high-performance computing, data centers, automotive, aerospace, and power electronics. Key clients include semiconductor companies and hyperscalers who face significant cooling challenges, particularly as AI data centers increasingly adopt liquid cooling. By providing a more effective way to manage heat, the company's products aim to improve the performance and reliability of electronic systems. In January 2025, the company announced it had secured a $2 million seed funding round led by M Ventures, with participation from Foothill Ventures and TDK Ventures. This capital is intended to expand operations, accelerate commercialization, and scale manufacturing to meet market demand.

Keywords: thermal interface materials, heat dissipation, nanocomposite, semiconductor cooling, data center cooling, thermal management, nanostructured materials, high-performance computing, power electronics, thermal resistance, advanced materials, electronics manufacturing, vertically aligned copper nanostructures, roll-to-roll manufacturing, liquid cooling solutions, CPU cooling, GPU cooling, venture capital, M Ventures, TDK Ventures