Ningbo Yongqiang Technology
High-precision IC packaging substrates for semiconductors.
| Date | Investors | Amount | Round |
|---|---|---|---|
* | N/A | Series B | |
| Total Funding | 000k | ||
Ningbo Yongqiang Technology Co., Ltd. is a specialized manufacturer operating in the semiconductor packaging sector. Established in 2019 and headquartered in Zhejiang, China, the firm focuses on the production of integrated circuit (IC) substrates. These substrates are critical components that provide the electrical connection and physical support for silicon chips within an electronics assembly.
The company's core business involves the development and technical services related to high-precision and high-density substrates, which are essential for modern semiconductor performance. This market segment demands significant technical expertise in areas like precise line imaging and multi-layer fabrication. Ningbo Yongqiang Technology holds 32 patents, underscoring its commitment to research and development in a technologically intensive industry.
Operating within China's growing semiconductor ecosystem, the company is positioned to address the increasing demand for advanced packaging solutions. The global IC substrate market is characterized by high concentration and substantial growth projections, driven by the expansion of high-performance computing, AI, and consumer electronics. The company’s establishment aligns with Ningbo's strategic initiative to foster 'future industries,' including cutting-edge new materials and future intelligence, aiming to enhance the region's position in the global technology value chain.
Keywords: IC substrate, semiconductor packaging, circuit board, flip-chip, BGA substrate, high-density interconnect, Ajinomoto Build-up Film, ABF, BT substrate, packaging materials, electronics manufacturing, technical services, advanced materials, wafer-level packaging, system-in-package, FC-BGA, FC-CSP, semiconductor components