Nanjing Ruiwei New Material Technology

Nanjing Ruiwei New Material Technology, established in 2021, is a specialized provider of thermal management solutions for the semiconductor industry. Based in Nanjing, China, the company focuses on the development of chip-level heat dissipation materials. This strategic direction is supported by a collaboration with the Nanjing University of Aeronautics and Astronautics, aimed at creating next-generation diamond/metal heat dissipation materials.

The company's core business revolves around supplying materials and solutions designed to manage heat in high-power electronic components. Its product portfolio includes high-power core chip heat sinks, heat dissipation cold plates, and comprehensive thermal management systems. These products are crucial for the semiconductor manufacturing sector, enabling the production of high-quality chips by addressing critical thermal challenges. The firm operates on a business-to-business (B2B) model, serving clients within the semiconductor production chain.

Since its inception, Nanjing Ruiwei New Material Technology has progressed through several funding stages, indicating investor confidence in its technology and market position. The company completed a Seed Round in December 2021, followed by a Series A round in June 2023, a Series A1 in August 2024, and a Series A2 in December 2024. It is backed by several venture capital firms, including Addor Capital, Nanjing Innovation Capital, Legend Capital, and Zijin Hi-Tech Venture Capital, among others. This consistent attraction of capital underscores its status as a venture-backed entity currently generating revenue.

Keywords: thermal management solutions, heat dissipation materials, semiconductor industry, chip cooling, diamond-metal composites, thermal systems, venture capital-backed, high-power electronics, advanced materials, cold plates, heat sinks, Nanjing, electronics manufacturing, semiconductor components, thermal engineering, material science, chip-level cooling