
Kuprion
Engineering break-through electronics: cooler, power saving by replacing solder with copper: 7x improved electrical & thermal conductivity.
Date | Investors | Amount | Round |
---|---|---|---|
- | investor | €0.0 | round |
N/A | €0.0 | round | |
$5.0m | Series A | ||
Total Funding | 000k |
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Kuprion, based in Northern Silicon Valley, specializes in the formulation, manufacture, and engineering of advanced copper materials for high power electronics. The company operates in the high-frequency 5G networks and high power electronics market, addressing critical power and thermal challenges. Kuprion's core product offerings include sintering pastes, adhesives, inks, and gaskets, which are designed to improve thermal performance and reliability. These materials are engineered to be resistant to oxidation at room temperature and can be processed in unlimited reflow cycles, making them a viable alternative to high-temperature solder and sintered silver. Kuprion serves clients in the semiconductor and electronics manufacturing industries, providing solutions that minimize temperature-induced stresses and prevent permanent damage to semiconductor devices. The business model revolves around the sale of these specialized materials, leveraging over 20 patents worldwide to maintain a competitive edge. Revenue is generated through direct sales to manufacturers and possibly through licensing agreements for their patented technologies.
Keywords: Copper materials, high power electronics, thermal performance, reliability, sintering pastes, adhesives, inks, gaskets, semiconductor devices, 5G networks.