Jingcun Technology
A high-tech enterprise integrating design, R&D, packaging, testing and sales.
| Date | Investors | Amount | Round |
|---|---|---|---|
* | CNY200m | Series B | |
| Total Funding | 000k | ||
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Established in 2016, Shenzhen Jingcun Technology Co., Ltd. (also known as Rayson HI-TECH) is a high-tech enterprise specializing in memory chips, integrating design, research and development, testing, and sales. The company has positioned itself as a comprehensive storage solution provider, controlling a significant portion of its value chain. This vertical integration was notably enhanced in 2020 through the acquisition of Artmem Technology, which brought in crucial flash memory controller chip R&D and firmware development capabilities.
The company's product portfolio is extensive, covering both consumer-grade and the more stringent industrial and automotive-grade storage chips. Offerings include NAND flash controller chips, eMMC, UFS, SSDs, and various DRAM memory modules such as DDR3/4 and LPDDR4/4X/5/5X. These products serve a wide array of markets, finding applications in consumer electronics like smartphones, laptops, and smart TVs, as well as in industrial equipment, IoT devices, medical technology, and automotive systems. The automotive solutions, for instance, are designed for high reliability and temperature resistance in applications like intelligent cockpits, ADAS, and in-vehicle central control, with products certified to the AEC-Q100 standard.
Jingcun Technology operates a strategic global footprint with its headquarters and a global marketing center in Shenzhen. Further expanding its capabilities, the company established a chip R&D center in Zhuhai, an intelligent manufacturing center in Zhongshan, and a global logistics and delivery center in Hong Kong. This structure supports its entire industrial chain from controller R&D to final sales. The firm has demonstrated consistent growth, marked by key milestones such as its Series A financing in 2021, a Series B led by Dachen in 2022, and a Series C in 2024. These steps have supported major product developments, including the mass production of LPDDR5/5X and the launch of its self-developed UFS controller to the market in 2024.
Keywords: memory chips, storage solutions, NAND flash, eMMC, UFS, LPDDR5, SSD, automotive storage, industrial-grade memory, consumer electronics components, memory modules, semiconductor, Artmem Technology, integrated circuit design, firmware development, AEC-Q100, intelligent manufacturing, storage controller, Shenzhen, high-tech enterprise