Jing Chuang Advanced Electronic

Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. operates as a specialized developer and manufacturer of high-precision dicing equipment for the semiconductor industry. Established in 2013 in Suzhou, China, the company was founded by a team with extensive experience in the semiconductor sector, aiming to address the market's reliance on foreign-produced equipment. The legal representative and founder, Yang Yunlong, is a technical expert with over two decades of experience in the semiconductor equipment field. His background and the team's collective expertise were pivotal in navigating the high technical barriers of the industry, particularly in creating domestically produced alternatives to the market-dominant Japanese manufacturers.

The firm's business model is centered on the research, development, production, sales, and service of machinery crucial for the semiconductor packaging process. It generates revenue by selling a range of dicing machines and related auxiliary equipment to clients in semiconductor manufacturing and assembly. Its products are utilized for the intricate and precise cutting of various materials, including semiconductor wafers, integrated circuits, LED chips, optical communication components, and MEMS devices. A significant achievement for the company was the successful mass production of a 12-inch automatic dicing machine, a key product that filled a gap in the domestic Chinese market.

Jingchuang Advanced Electronic offers a comprehensive portfolio of products, including its AR series of automatic precision dicing machines for 6, 8, and 12-inch wafers, laser dicing machines, and a suite of auxiliary equipment such as wafer mounters, cleaning machines, and UV irradiation systems. The company emphasizes a modular design approach to its machinery, which allows for greater customization to meet specific client needs and improves production efficiency. The company has secured significant funding through multiple rounds, including an Angel round in March 2019, a Series A in July 2020, a substantial Series B in August 2021, and a Series B+ in March 2023, enabling further investment in R&D, production capacity, and market expansion.

Keywords: semiconductor equipment, precision dicing, wafer cutting, dicing machines, semiconductor packaging, automatic dicing saw, laser dicing, integrated circuit manufacturing, LED chip dicing, MEMS dicing, Yang Yunlong, Chinese semiconductor technology, wafer processing, dicing solutions, high-tech manufacturing, semiconductor back-end equipment, grinding and polishing technology, advanced packaging, domestic equipment substitution, precision machinery