JetCool Technologies
Compact cooling solutions for high power electronics.
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| - | investor investor investor | €0.0 | round |
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| Total Funding | 000k | ||
JetCool Technologies Inc. operates in the high-performance computing and data center cooling market, addressing the growing thermal challenges presented by modern, power-dense electronics. The company was founded in 2019 by Bernie Malouin, who serves as the CEO. Malouin's background includes a Ph.D. in Mechanical Engineering from MIT and extensive experience in thermal management and electronics cooling, including a tenure at the MIT Lincoln Laboratory, which provides a strong technical foundation for the company's direction.
The core of JetCool's business is its proprietary microconvective cooling technology, which utilizes small, targeted jets of dielectric fluid to cool high-power components like CPUs and GPUs directly. This method is designed to be significantly more effective and efficient than traditional air-cooling or cold plate solutions. The company's product line includes the JetCool Module (or cooling module) and the SmartPlate, which are engineered to reduce thermal resistance and manage heat loads exceeding 1000W per chip. These products enable data centers to increase compute density and performance without the extensive infrastructure required for direct-to-chip liquid cooling systems that use facility water.
JetCool's business model revolves around selling these advanced cooling modules and related hardware to data center operators, high-performance computing clusters, and semiconductor manufacturers. By offering a self-contained liquid cooling solution, the company targets clients looking to enhance the performance and efficiency of their existing infrastructure while mitigating the risks of overheating and thermal throttling. The firm has achieved notable milestones, including securing an R&D contract with the U.S. Air Force to cool radar systems and raising significant venture capital, with a $17 million Series A round announced in September 2023 led by Bosch Ventures.
Keywords: data center cooling, liquid cooling, thermal management, microconvective cooling, semiconductor cooling, high-performance computing, electronics cooling, chip cooling, sustainable computing, direct-to-chip