
InSilica
Asic and system-on-chip solutions and multimedia and printing processors.
Date | Investors | Amount | Round |
---|---|---|---|
- | investor | €0.0 | round |
investor investor investor investor | €0.0 | round | |
investor investor investor investor investor | €0.0 | round | |
N/A | $2.1m | Debt | |
Total Funding | 000k |
USD | 2020 | 2021 | 2023 |
---|---|---|---|
Revenues | 0000 | 0000 | 0000 |
EBITDA | 0000 | 0000 | 0000 |
Profit | 0000 | 0000 | 0000 |
EV | 0000 | 0000 | 0000 |
EV / revenue | 00.0x | 00.0x | 00.0x |
EV / EBITDA | 00.0x | 00.0x | 00.0x |
R&D budget | 0000 | 0000 | 0000 |
Source: Dealroom estimates
Related Content
inSilica, Inc. operated as a fabless semiconductor company, focusing its resources on the design and marketing of Application-Specific Integrated Circuits (ASICs) and System-on-Chip (SoC) solutions while outsourcing the capital-intensive manufacturing process. Founded in 2003 and headquartered in Santa Clara, California, the company established a business model with executive and engineering leadership in Silicon Valley, complemented by a design and implementation team in India. This structure allowed it to concentrate on developing a proprietary design flow and intellectual property base. The company's business involved creating custom silicon for original equipment manufacturers (OEMs) and other fabless semiconductor suppliers.
inSilica specialized in developing multimedia and printing processors for a variety of imaging and printing devices. Its product applications expanded into several high-growth segments, including mobile phones, high-performance networking, high-definition video processing, and broadband wireless communications. The company's revenue was generated through the design and subsequent supply of these custom chips to its clients. A significant milestone occurred in April 2004 when it entered a strategic partnership with Flextronics, a major electronics manufacturing services provider, to enhance Flextronics' in-house silicon development capabilities. In July 2006, inSilica secured an $18 million financing round with participation from notable investors including Intel Capital and Flextronics, aiming to expand its intellectual property portfolio and scale its global operations.
The company's journey culminated in an acquisition by Broadcom Corporation. The acquisition integrated inSilica's SoC expertise and design teams into Broadcom's broader portfolio, a common strategy for larger semiconductor firms to absorb specialized technology and talent. Following the acquisition, the inSilica corporate identity, including its website and LinkedIn presence, was consolidated into Broadcom's.
Keywords: fabless semiconductor, system-on-chip, SoC solutions, ASIC design, multimedia processors, printing processors, mobile imaging, high-performance networking, video processing, broadband wireless, custom silicon, intellectual property, semiconductor design, Santa Clara startup, Broadcom acquisition, Flextronics partnership, Intel Capital investment, electronics design, integrated circuits, asset-light manufacturing
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