Huaxin Semiconductor Technology
Advanced compound semiconductor optoelectronic chips manufacturer.
Huaxin Semiconductor Technology Co., Ltd., also known as Sino-Semiconductor Integrated Optoelectronics Cooperation (SSIOC), is a developer and producer of advanced compound semiconductor optoelectronic chips. The company was established on December 11, 2015, with Peng Lingyong serving as the legal representative and chairman. Based in Taizhou City's Jiangyan High-tech Zone in Jiangsu province, the company's facilities span over 90 acres with 50,000 square meters of building space.
The company's core business involves the research, development, and production of cutting-edge compound semiconductor optoelectronic chips and their related application products. Huaxin Semiconductor utilizes internationally advanced equipment, including Metal-Organic Chemical Vapour Deposition (MOCVD) systems, for its chip manufacturing processes. The product portfolio includes high-brightness LEDs, blue-green semiconductor laser diodes, Vertical-Cavity Surface-Emitting Laser (VCSEL) photon chips, Distributed Feedback (DFB) photon chips, and Electro-absorption Modulated Laser (EML) photon chips. The company has demonstrated capabilities in the entire production process from epitaxial structure design and wafer production to chip manufacturing, which allows for customized products.
Huaxin Semiconductor's products are applied across various high-tech sectors, including laser display, laser lighting, laser TV, fiber optic communications, data centers, cloud computing, and supercomputing. The company has received multiple rounds of funding, including an A round in March 2019, a B round in December 2020, and a C round in February 2022. By 2017, the company had already started mass production and shipment of its VCSEL chips for optical communications.
Keywords: compound semiconductor, optoelectronic chips, VCSEL, laser diodes, photon chips, MOCVD, GaN, GaAs, fiber optic communications, data centers, laser display, semiconductor manufacturing, epitaxy, DFB chips, EML chips, integrated optoelectronics, high-brightness LED, supercomputing applications, cloud computing infrastructure, advanced packaging.