Hebei Sinopack Electronic Technology
A firm that specializes in the R&D, production and sale of electronic ceramic products.
| Date | Investors | Amount | Round |
|---|---|---|---|
| N/A | €0.0 | round | |
* | CNY2.5b | Post IPO Equity | |
| Total Funding | 000k | ||
| CNY | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 |
|---|---|---|---|---|---|---|---|
| Revenues | 0000 | 0000 | 0000 | 0000 | 0000 | 0000 | 0000 |
| % growth | 24 % | 29 % | 105 % | (1 %) | 21 % | 17 % | 21 % |
| EBITDA | 0000 | 0000 | 0000 | 0000 | 0000 | 0000 | 0000 |
| % EBITDA margin | 16 % | 14 % | 29 % | 32 % | 28 % | 29 % | 29 % |
| Profit | 0000 | 0000 | 0000 | 0000 | 0000 | 0000 | 0000 |
| % profit margin | 12 % | 11 % | 18 % | 20 % | 21 % | 21 % | 21 % |
| EV | 0000 | 0000 | 0000 | 0000 | 0000 | 0000 | 0000 |
| EV / revenue | 00.0x | 00.0x | 00.0x | 00.0x | 00.0x | 00.0x | 00.0x |
| EV / EBITDA | 00.0x | 00.0x | 00.0x | 00.0x | 00.0x | 00.0x | 00.0x |
| R&D budget | 0000 | 0000 | 0000 | 0000 | 0000 | 0000 | 0000 |
| R&D % of revenue | 14 % | 14 % | 11 % | 11 % | - | - | - |
Source: Company filings or news article, Equity research estimates
Hebei Sinopack Electronic Technology Co., Ltd. (SHE: 003031) operates as a specialized manufacturer engaged in the research, development, production, and sale of electronic ceramic products. Established in August 2009, the company is a state-controlled holding of the 13th Research Institute of China Electronics Technology Group Corporation (CETC), leveraging over 40 years of experience in ceramic package development. The company went public on the Shenzhen Stock Exchange on January 4, 2021.
The company's business focuses on providing the foundational packaging for high-tech semiconductor components, which serve as the crucial link between the internal chip and external circuits. Its product portfolio is diverse, catering to various high-demand sectors. Key product lines include ceramic packages for optical communication devices, wireless power devices, industrial lasers, infrared detectors, and consumer electronics. The firm also manufactures aluminum nitride (AlN) ceramic substrates and other ceramic components. These products are integral to applications in optical and wireless communications, automotive electronics, 5G networks, and industrial lasers. For instance, its optical communication packages support transmission rates from 10G up to 400G. Sinopack serves a global client base, including notable companies in the United States, Europe, and Japan.
Hebei Sinopack operates on a business-to-business (B2B) model, generating revenue through the direct sale of its extensive range of electronic ceramic products and by providing customized engineering and after-sales support services. The company possesses a complete manufacturing process for multilayer ceramic package casings, which includes raw material preparation, metallization, lamination, sintering, brazing, and plating. This end-to-end capability allows it to offer comprehensive technical solutions. As of March 31, 2025, the company reported a trailing twelve-month revenue of $377 million. The company has demonstrated a commitment to research and development, establishing long-term technical cooperation with institutions like Tsinghua University and the Chinese Academy of Sciences. This focus has enabled Sinopack to break the product monopoly previously held by international competitors in the domestic market for optical communication device ceramic shells.
Keywords: electronic ceramics, semiconductor packaging, multilayer ceramic packages, optical communication components, wireless power devices, HTCC, LTCC, AlN substrates, ceramic housings, industrial laser components, infrared detector packaging, automotive electronics, 5G components, high-frequency packaging, ceramic technology, hermetic packages, integrated circuit packaging, AIN DBC, power laser package, TOSA/ROSA ceramic packages