Guangwei Information Technology (Hefei)
Time-of-Flight (ToF) 3D sensing chips and solutions.
| Date | Investors | Amount | Round |
|---|---|---|---|
* | CNY20.0m | Series C | |
| Total Funding | 000k | ||
Guangwei Information Technology (Hefei) Co., Ltd., also known as Nephotonics, is a high-tech enterprise founded in 2016 that specializes in the research and development of 3D Time-of-Flight (ToF) chips and vision solutions. Headquartered in Hefei, China, the company also operates a branch in Shenzhen and maintains R&D centers in Shanghai and Oregon, USA. The firm's core business revolves around its proprietary I-ToF (Indirect ToF) and D-ToF (Direct ToF) sensor chip technologies, developing products from the chip level to complete 3D system solutions.
The company’s product portfolio includes ToF chips, 1D ToF sensors, ToF modules, and comprehensive 3D solutions. These products serve a wide range of industries, including consumer electronics, automotive, industrial security, robotics, and smart homes. Applications range from camera focus and face recognition in smartphones to obstacle avoidance in drones and robots, gesture recognition in smart home devices, and 3D face recognition and volume measurement. Guangwei Information Technology generates revenue by providing these specialized 3D ToF chips and vision solutions to its clients.
Since its inception, the company has achieved several milestones, including the launch of its first D-ToF chip for internal testing in 2016 and its first I-ToF chip in 2017. In 2020, it mass-produced its first micro ToF sensor. The company relocated its headquarters to Hefei in 2022 after securing Series B1 strategic financing from investors including Hefei Industrial Investment Group and Haiheng Capital. In 2023, Guangwei was recognized as a National High-tech Enterprise and an Anhui "Specialized, Specialized and New" SME. A recent strategic investment in June 2024 is intended to fund further technology development and mass production of its 3D sensing chip products.
Keywords: Time-of-Flight sensors, 3D vision solutions, I-ToF chips, D-ToF chips, sensor development, 3D sensing, machine vision, obstacle avoidance, face recognition, gesture recognition, consumer electronics, automotive sensors, industrial security, smart home technology, robotics components, drone technology, AR/VR components, 3D measurement