
Global Power Technology
Pioneering the industrialization of China's silicon carbide (SiC) power devices,.
Date | Investors | Amount | Round |
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investor investor | €0.0 | round | |
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* | CNY200m | Late VC | |
Total Funding | 000k |
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Global Power Technology (Beijing) Co., Ltd., also known as 泰科天润半导体科技(北京)有限公司, is a key player in China's burgeoning third-generation semiconductor industry, specializing in the research, development, and manufacturing of silicon carbide (SiC) power devices. Founded in 2011 by Chairman and CEO Chen Tong, the company has established itself as a proponent of the industrialization of SiC power components in the country. Chen Tong is recognized as a high-level talent in Zhongguancun and is a member of the third-generation semiconductor expert group for the Ministry of Science and Technology.
Operating on an Integrated Device Manufacturer (IDM) model, the company manages its entire production process, from SiC wafer manufacturing to device packaging and application solutions. Its headquarters are located in Beijing's Dongsheng Science Park in Zhongguancun, and it operates two SiC semiconductor wafer fabrication lines. A significant milestone was the establishment of a 6-inch SiC power electronic device production line in Liuyang, Hunan, in December 2019, a project jointly funded with the Liuyang High-tech Zone. This expansion was aimed at achieving an annual production capacity of 60,000 6-inch SiC power chips.
The firm's business model encompasses the manufacturing and sales of SiC devices, providing technical services, and offering foundry services for custom product designs. Its clientele operates in high-growth sectors such as new energy vehicles, photovoltaics, industrial power supplies, EV charging stations, and consumer electronics. Products include a wide array of SiC Schottky diodes, SiC MOSFETs, and power modules across various voltage ratings, which have been mass-produced and are comparable in quality to international standards. The company has secured numerous rounds of funding, including a significant Series E round in August 2023 and a strategic financing round in July 2024, to support its expansion and product development.
Keywords: Silicon Carbide (SiC), power semiconductors, Integrated Device Manufacturer (IDM), power devices, SiC MOSFET, Schottky diodes, third-generation semiconductor, wafer fabrication, automotive electronics, EV charging, photovoltaics, power modules, semiconductor manufacturing, Chen Tong, Zhongguancun, Liuyang, industrial power, consumer electronics, foundry services, power electronics