
Fujian Huixin Laser Technology
Innovative optoelectronic chips for telecom, data centers, and consumer electronics.
Date | Investors | Amount | Round |
---|---|---|---|
* | CNY100m Valuation: CNY1.5b | Series A | |
Total Funding | 000k |
Xinte Lasers specializes in the development of advanced optoelectronic chips and components using III-V compound semiconductors, targeting diverse applications in telecommunications, data centers, consumer electronics, and medical sciences. The company's core products include Vertical Cavity Surface Emitting Laser (VCSEL) chips for 3D sensing and imaging, high-speed VCSEL chips for data communication, high-speed distributed feedback laser (DFB) chips, Electro-absorption Modulated Laser (EML), and high-speed photodetector (PD) chips for telecom applications. Xinte Lasers serves clients in sectors that require high-performance and reliable optoelectronic solutions, such as tech companies, telecom providers, and medical device manufacturers. Operating in the semiconductor industry, the company generates revenue through the sale of its specialized chips and components, leveraging its expertise in chip design, epitaxial growth, fabrication, and testing. The business model focuses on innovation and high-volume production to meet the demands of consumer and industrial markets. Keywords: optoelectronic chips, VCSEL, DFB, EML, photodetector, telecommunications, data centers, consumer electronics, semiconductor, III-V compound.