
Eliyan
Accelerating a Smarter Future by Revolutionizing Chiplet-based Systems.
Date | Investors | Amount | Round |
---|---|---|---|
- | investor | €0.0 | round |
investor investor investor investor | €0.0 | round | |
* | $60.0m | Series B | |
Total Funding | 000k |
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Eliyan is a semiconductor company that specializes in chiplet interconnect technology. The company addresses the challenge of scaling semiconductor performance by providing a method for connecting chiplets, which are small, specialized integrated circuits, into a larger, more powerful system.
Its core technology, NuLink, is a die-to-die (D2D) interconnect that facilitates high-speed, low-latency communication between chiplets. This approach allows for the creation of complex semiconductor systems with improved performance, reduced power consumption, and lower costs compared to traditional monolithic chip designs or other advanced packaging solutions. The business model likely revolves around licensing its interconnect technology to semiconductor designers and manufacturers, enabling them to build multi-die systems for various applications, including high-performance computing, artificial intelligence, and data centers. The company serves clients in the semiconductor industry, from fabless design houses to integrated device manufacturers.
Keywords: chiplets, interconnect, semiconductor, die-to-die, high-performance computing, low-power, high-bandwidth, NuLink, packaging, silicon