CoVi Technologies
Security solutions for businesses, developing high definition sensor-based products and surveillance software.
| Date | Investors | Amount | Round |
|---|---|---|---|
| - | investor | €0.0 | round |
| investor investor investor investor | €0.0 | round | |
| investor investor investor investor | €0.0 | round | |
$4.0m | Series A | ||
| Total Funding | 000k | ||
CoVi Technologies, officially incorporated in June 2001 and headquartered in Richardson, Texas, operates within the semiconductor and electronics manufacturing sector. The company's strategic location in the Dallas suburb places it within the region's prominent Telecom Corridor, providing a distinct advantage in serving the technology industry. The business was founded by a team of experienced engineers, with Terence Collier serving as a key contact for the organization. From its inception, the firm has been ITAR compliant, underscoring its commitment to operating within U.S. export regulations for defense-related articles and services.
CoVi Technologies provides a range of specialized engineering solutions and services focused on semiconductor packaging and assembly. The company's business model is centered on delivering quick-turn, high-quality services for clients requiring custom microelectronics solutions. Core services include wafer bumping, the creation of redistribution layers (RDL), and ENIG (Electroless Nickel Immersion Gold) pillars. They offer packaging solutions such as overmolded and open-cavity Quad-Flat No-leads (QFN) packages, as well as BGA (Ball Grid Array) and LGA (Land Grid Array) services. The firm also provides assembly services for small form factor boards and modules, including substrate design and fabrication.
A specialized area of their operations includes services for single die and partial wafers, die extraction, and the fabrication of dummy die used for testing and process setup. Furthermore, CoVi Technologies addresses the need for component and board-level maintenance by offering PCB and substrate layout services and die repair kits. The company serves a client base that requires rapid prototyping and manufacturing for complex electronic components, continuously working to enhance packaging density and reduce costs.
Keywords: semiconductor packaging, wafer bumping, microelectronics assembly, QFN packages, redistribution layer, ITAR compliant, PCB layout, single die bumping, electronic engineering solutions, die repair