CLOP Technologies
Singapore-based company established to provide world-class compelling and affordable solutions.
CLOP Technologies Pte Ltd is a fabless semiconductor company headquartered in Singapore that provides high-speed wireless connectivity solutions. Founded in November 2015 by CEO Albert Chai, the company originated as a spin-off from A*STAR, a Singapore government-funded research agency. Albert Chai, who previously spent over eight years in advanced communication technology R&D at A*STAR, was inspired by Singapore's Smart Nation initiative to commercialize the agency's technology. The name "CLOP" stands for "Connecting the Lives Of People," reflecting its mission to provide affordable gigabit wireless connectivity.
The company operates within the semiconductor and Internet of Things (IoT) markets, focusing on developing and supplying custom chipsets for high-speed wireless communication. Its business model is centered on designing and selling these semiconductor solutions to original equipment manufacturers (OEMs) and other businesses that require robust wireless infrastructure. CLOP Technologies has secured funding from investors including IncuVest, the National Research Foundation, and a S$0.3 million convertible loan from PlanetSpark, an investment arm of Excelpoint Technology Ltd.
CLOP Technologies' core product is a 60GHz wireless solution based on the IEEE 802.11ad (WiGig) standard. This technology is engineered to deliver peak data rates of up to 4.6Gbps, which is significantly faster than conventional Wi-Fi. The solution is designed to serve as a cost-effective alternative to fiber optic cables for last-mile connectivity, enabling rapid data transfer for applications like uncompressed HD video streaming and industrial IoT. Key features include a long-range capability of up to 1km, AES-128 hardware security, a USB 3.0 host interface for easy integration, and robust performance through RF impairment compensation. The company has engaged in partnerships, including a memorandum of understanding with Sivers IMA to create a fully integrated WiGig-compliant communications module by combining their respective technologies.
Keywords: fabless semiconductor, 60GHz wireless, IEEE 802.11ad, WiGig, wireless connectivity, chipset design, Smart Nation, A*STAR spin-off, IoT infrastructure, gigabit wireless, last-mile connectivity, Albert Chai, high-speed data transfer, RFIC design, wireless point-to-point, wireless infrastructure, CT6100, custom chipsets, silicon design, communication technology