Chuangsheng Semiconductor

Chuangsheng Semiconductor (Shenzhen) Co., Ltd., which also operates as Transcend Semiconductor, is a fabless semiconductor company established in 2023 with a focus on the mid- to high-end automotive-grade communication chip market. The company operates on a business-to-business (B2B) model, designing and manufacturing semiconductors for other businesses. While the specific founders are not publicly detailed, the core research and development team is composed of seasoned professionals from leading international semiconductor firms like Texas Instruments (TI) and Analog Devices (ADI), with key members possessing over two decades of experience in the field. This extensive background in high-speed and mixed-signal integrated circuit design for automotive, industrial, and consumer sectors informs the company's strategic direction.

The company's product development is centered on addressing the growing demand within the automotive industry, particularly as vehicle electronic and electrical (E/E) architecture evolves from distributed to centralized systems. Chuangsheng is developing in-vehicle audio bus solutions and other communication chips designed to offer low latency, high bandwidth, and robust EMC/EMI performance, positioning them to compete with established foreign products. For instance, its MBus1.0 product, which taped out in April 2024, successfully passed functional and customer-level automotive tests by August 2024, with mass production anticipated for July 2025. This B2B revenue model is based on the sale of these specialized chips to automotive Tier 1 suppliers and original equipment manufacturers (OEMs).

Chuangsheng Semiconductor has secured significant financial backing to fuel its ambitious product roadmap. In May 2025, the company announced the completion of its angel and angel-plus funding rounds, raising nearly CNY 100 million. The investment round saw participation from a diverse group of strategic and financial investors, including Huaye Tiancheng, AAC Technologies, iFLYTEK Venture Capital, and Guoyuan Innovation Investment. This capital infusion supports the company's operational expansion and its goal to become a key domestic player in China's intelligent high-speed vehicle bus chip sector. Headquartered in Pudong, Shanghai, Chuangsheng also maintains offices in Shenzhen, China, and Dallas, Texas, to support its global ambitions.

Keywords: automotive communication chips, semiconductor design, fabless semiconductor, in-vehicle audio bus, mixed-signal IC design, high-speed interface chips, automotive electronics, E/E architecture, vehicle bus solutions, low latency chips, high bandwidth semiconductors, EMC/EMI performance, MBus technology, B2B semiconductor, automotive Tier 1 supplier, automotive OEM, angel funding, venture capital, Huaye Tiancheng, AAC Technologies, iFLYTEK, Guoyuan Innovation Investment, Shenzhen, Shanghai, Dallas