
Chirp Microsystems
Chirp’s ultrasound 3D sensing technology combines ultralow power, small form-factor with intelligent firmware, enabling new UI/UX for IoT.
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Total Funding | 000k |
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Chirp Microsystems, a TDK Group company, specializes in the development of micro-scale ultrasonic sensing technology. The firm was established in 2013, originating from pioneering research conducted at the University of California's Berkeley Sensor and Actuator Center (BSAC). The founding team includes David Horsley, a professor at UC Davis and co-director of BSAC, who serves as the Chief Technology Officer, and Michelle Kiang as CEO, along with Andre Guedes, Stefon Shelton, and Richard Przybyla. Horsley's academic and professional background in MEMS, sensors, and actuators provided the foundational expertise for the company's technology.
The company's core business revolves around designing and manufacturing high-performance, low-power piezoelectric MEMS (micro-electromechanical systems) ultrasonic transducers. These sensors operate on the principle of sonar or echolocation, emitting an ultrasonic pulse and measuring the time-of-flight (ToF) for the echo to return, which allows for precise distance measurement. This technology is consolidated into a system-in-package (SiP) that integrates the MEMS transducer with a power-efficient digital signal processor (DSP) and a microcontroller, creating a complete "sonar on a chip" solution. The business model focuses on providing these sensor solutions to developers and manufacturers of electronic devices. In February 2018, Chirp was acquired by TDK Corporation, becoming a business unit within TDK's subsidiary InvenSense, to accelerate the commercialization and distribution of its technology.
Chirp's main products are the CH-101 and CH-201 ultrasonic ToF sensors. These sensors are distinguished by their miniature size (3.5mm x 3.5mm) and extremely low power consumption, making them suitable for battery-powered devices. Key benefits include the ability to function in all lighting conditions, from direct sunlight to complete darkness, and the capacity to detect objects regardless of their color or optical transparency, including clear materials like glass. The CH-101 is designed for short-range applications up to 1.2 meters, while the CH-201 targets long-range sensing up to 5 meters. The technology serves a broad client base across consumer electronics, automotive, robotics, industrial automation, and the Internet of Things (IoT). Specific applications include presence and proximity detection in smart home devices and laptops, gesture recognition for AR/VR controllers, collision avoidance for drones and robots, and liquid-level sensing.
Keywords: ultrasonic sensors, MEMS transducer, time-of-flight sensor, 3D sensing, gesture recognition, proximity detection, low-power sensors, TDK Group, InvenSense, David Horsley, piezoelectric micromachined ultrasonic transducer, PMUT, range finding, object avoidance, AR/VR tracking, robotics sensing, IoT sensors, occupancy detection, CH-101, CH-201