Chengdu Maike Technology
A microsystem key material and integration technology developer.
| Date | Investors | Amount | Round |
|---|---|---|---|
| investor investor investor | €0.0 | round | |
* | CNY20.0m | Seed | |
| Total Funding | 000k | ||
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Chengdu Maike Technology Co., Ltd., operating as cdmicrotech.com, is a specialized manufacturer of advanced materials for microsystem integration and packaging, established in 2017. The company focuses on the 3D integrated microsystem market, providing key technologies and products. Its core business revolves around the production of Through Glass Via (TGV) processed items, Integrated Passive Devices (IPD), and 3D microstructured glass.
The company's product portfolio is designed to serve clients requiring sophisticated and reliable microsystem components. Offerings include TGV processing services, which are crucial for creating vertical interconnects in 3D-integrated circuits, and IPD passive integrated devices that consolidate multiple passive electronic components into a single package. Additionally, the company fabricates specialized 3D microstructured glass and develops proprietary process equipment specifically for TGV applications. This positions the firm as a supplier to industries that depend on high-performance, miniaturized electronic systems.
Financially, Chengdu Maike Technology is privately held and has successfully attracted investment from several capital ventures. Key investors include Sinovation Ventures, Addor Capital, Sichuan Development Fund, Spotlight Capital (China), and Wuhan DR Laser Technology. This backing indicates confidence in the company's technology and market position within the advanced manufacturing and electronics sectors.
Keywords: Through Glass Via, TGV, Integrated Passive Device, IPD, 3D microstructured glass, microsystem integration, advanced packaging material, 3D integrated microsystem, electronic components, semiconductor packaging, Sinovation Ventures, Addor Capital, advanced manufacturing, microsystem technology, passive integration, glass-based components, electronic materials, high-performance electronics, miniaturization technology, Sichuan Development Fund.