
Hangzhou Bibo Technology (Bibo Semiconductor )
Fabless 5G industrial and automotive chip design.
Date | Investors | Amount | Round |
---|---|---|---|
investor investor investor investor investor investor investor investor investor investor investor investor | €0.0 | round | |
* | CNY100m Valuation: CNY1.0b | Seed | |
Total Funding | 000k |
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Hangzhou Bibo Technology Co., Ltd., also known as Bibo Semiconductor, is a fabless semiconductor company established in March 2021. The company specializes in the research and development of core chips and platforms for 5G, Industrial Internet of Things (IIoT), and vehicle networking. Bibo Semiconductor's expertise covers a wide range of technologies, including communication baseband algorithms, radio frequency (RF), ASIC, SoC architecture, and software platforms.
The company was founded by a team with extensive experience from leading international communication IC design firms. The CEO, Dr. Li Junqiang (Jet), holds a doctorate in communication and information systems from Tsinghua University and has over 23 years of experience in the wireless communication industry, with previous roles at Samsung, Broadcom, Qualcomm, MediaTek, and as a senior R&D vice president at Spreadtrum Communications. Founder Zhang Zhenrui also serves on the management team.
Bibo Semiconductor operates on a fabless business model, focusing on the design and development of high-tech communication chips while outsourcing the manufacturing process. The company targets the 5G RedCap (Reduced Capability), eMBB (Enhanced Mobile Broadband), and future communication standards for IoT and automotive applications. One of its key products is the U560, an air-to-ground integrated multi-mode terminal chip that combines lightweight 5G RedCap, low-orbit satellite NTN (Non-Terrestrial Networks), and 4G technologies. This chip also features high-precision positioning and is aimed at the satellite internet market.
Since its inception, Bibo Semiconductor has secured significant funding. It completed an angel round of over 100 million yuan in December 2021 from investors including Haitsing Capital, Oriental Fortune Capital, and Tuya Smart. In early 2023, it raised several hundred million yuan in a Pre-A round, followed by a Pre-A+ round led by SAIF Partners. The company has received numerous awards, including being named a quasi-unicorn in Hangzhou and winning the "Most Growth Potential Award" at the 2024 IC Cumulus List.
Keywords: 5G RedCap, fabless semiconductor, IoT chips, automotive communication, baseband algorithms, SoC design, Non-Terrestrial Networks (NTN), communication IC design, satellite communication chips, U560 chip, Li Junqiang, Zhang Zhenrui