
Anhui Changfei Advanced Semiconductor
Silicon carbide power semiconductor device manufacturer.
Date | Investors | Amount | Round |
---|---|---|---|
investor | €0.0 | round | |
investor | €0.0 | round | |
* |
| CNY3.8b | Series A |
Total Funding | 000k |
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Anhui Changfei Advanced Semiconductor (YASC) is an integrated device manufacturer (IDM) founded in 2018, specializing in silicon carbide (SiC) power semiconductor products. The company manages the entire industrial chain, including epitaxial growth, device design, wafer fabrication, and module packaging and testing. YASC operates from its headquarters in Wuhu, Anhui, with additional production bases in Wuhan and sales offices in Shanghai and Shenzhen.
YASC serves strategic emerging industries by providing SiC SBD and MOSFET products ranging from industrial to automotive grade. Its products are primarily used in new energy vehicles (NEVs), photovoltaics, energy storage, charging stations, and smart grids. The company's business model is centered on being an IDM, covering research and development, manufacturing, and sales of its own inventory. It aims to be a leading global wide-bandgap semiconductor company. The firm has two production bases in Wuhu and Wuhan with a combined annual production capacity of 420,000 SiC wafers.
Formerly known as Wuhu Qidi Semiconductor Co., Ltd., the company completed a significant merger and reorganization in May 2022. In 2023, YASC secured over CNY 3.8 billion in a Series A equity financing round, noted as the largest in China's third-generation semiconductor private equity sector at the time. Key investors include Optics Valley Financial Holding Group, CICC Capital, and Dongfeng Asset Management, alongside existing shareholders like YOFC. The company recently completed a shareholding reform to optimize its governance structure and enhance its market competitiveness.
Keywords: silicon carbide, power semiconductors, integrated device manufacturer, SiC MOSFET, wafer fabrication, automotive grade, epitaxial growth, new energy vehicles, photovoltaics, energy storage, charging stations, smart grid, wide-bandgap semiconductor, power modules, third-generation semiconductor, device design, module packaging