Shenzhen Aixin Semiconductor Technology

Shenzhen Aixin Semiconductor Technology

Aixin Semiconductor Technology specializes in the production of semiconductor front-end measurement and testing equipment.

HQ location
Ningbo, China
Launch date
Enterprise value
$110—165m
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Shenzhen Aixin Semiconductor Technology Co., Ltd., which operates under the English brand Angstrom Excellence (AE), is a specialized developer and manufacturer of high-tech metrology equipment for the semiconductor industry. The firm was established in October 2020 by Dr. Zhang Xuena, who serves as the company's Founder, Chairman, and CTO.

Dr. Zhang's journey is deeply rooted in the semiconductor world; after graduating from the University of Science and Technology of China, she earned a Ph.D. in Physics from Germany's Max Planck Institute and conducted postdoctoral research at Stanford University. Her extensive 20-year career includes key positions such as Global Product Director and R&D lead at premier international semiconductor companies, including KLA and Applied Materials. This experience provided her with comprehensive expertise in semiconductor equipment technology, product development, and global marketing. Dr. Zhang founded Angstrom Excellence with the mission to address critical dependencies on foreign technology by developing proprietary, foundational innovations within China's semiconductor ecosystem.

The company's business model is centered on the research, development, manufacturing, and sale of front-end process control equipment used in wafer fabrication. It serves a sophisticated client base involved in the production of advanced logic, DRAM, and 3D NAND chips. Revenue is generated through the sale of its specialized metrology and inspection systems. The company operates a 7,300㎡ R&D and production facility in Shenzhen, which includes advanced clean rooms. Angstrom Excellence's product portfolio provides a wide range of solutions organized into two main categories: optical metrology and X-ray metrology. The optical line is designed for measuring film thickness and critical dimensions, while the X-ray series is used for analyzing film thickness, material properties, and detecting surface contamination.

Keywords: semiconductor metrology, wafer fabrication equipment, process control solutions, front-end semiconductor, optical measurement, X-ray inspection, Angstrom Excellence, Dr. Zhang Xuena, advanced logic chips, DRAM manufacturing, 3D NAND, thin film measurement, critical dimension metrology, surface contamination analysis, semiconductor equipment manufacturer, wafer inspection tools, Chinese semiconductor industry, KLA competitor, Applied Materials competitor

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