
ACCURACY
High-precision semiconductor micro-assembly and packaging equipment.
Date | Investors | Amount | Round |
---|---|---|---|
* | CNY100m | Early VC | |
Total Funding | 000k |
Suzhou Accuracy Assembly Automation Co., Ltd. (ACCURACY) is a high-tech enterprise specializing in the research, development, design, production, and sales of semiconductor packaging and testing equipment. Founded in 2010 by Wang Chi, the company is headquartered in Suzhou, China. Wang Chi, the company's founder and chairman, holds dual master's degrees from the Hong Kong University of Science and Technology and Hong Kong Baptist University.
The company focuses on developing high-speed, high-precision, and intelligent semiconductor packaging equipment. Its core business provides advanced packaging solutions for clients in sectors such as integrated circuits (ICs), microwave components, high-speed optical modules, and MEMS sensors. ACCURACY's product portfolio includes multiple series of machines, such as die bonders and high-precision multi-function die attach systems, designed for various applications including IC packaging, System-in-Package (SiP), and multi-chip modules. The company leverages expertise in machine vision and motion control technology to serve its clients.
ACCURACY operates a modern manufacturing base and has established R&D and design centers. It has a significant domestic market presence with service centers in major Chinese technology hubs to provide sales and after-sales support. The company has formed strategic partnerships with prominent state-owned enterprises and technology leaders in China, including China Electronics Technology Group Corporation (CETC) and China Aerospace Science and Industry Corporation (CASIC). ACCURACY has received recognition as a national "Specialized, Refined, Special, and New" Little Giant enterprise, a designation for leading SMEs in strategic sectors.
Keywords: semiconductor packaging equipment, micro-assembly solutions, die bonding, die attach systems, System-in-Package, machine vision, motion control, integrated circuit packaging, optical module assembly, MEMS sensor packaging, advanced packaging, Suzhou Accuracy, high-precision manufacturing, semiconductor backend, automation equipment