Accelsius

Accelsius addresses the escalating thermal management challenges in data centers driven by high-performance computing (HPC) and artificial intelligence workloads. The company was founded in June 2022 by Innventure, a technology commercialization firm that uses intellectual property from sources like Nokia's Bell Labs to build and scale new companies. Based in Austin, Texas, Accelsius operates primarily in the data center cooling market, serving a diverse client base that includes enterprises, colocation providers, telecommunications firms, financial services, and academic and research institutions.

The company's business model revolves around the design, manufacturing, and sale of its proprietary NeuCool™ liquid cooling systems. This is supplemented by a comprehensive suite of enterprise-grade lifecycle services, managed through its 'Ascent Model,' which guides clients through the transition from traditional air cooling to advanced liquid cooling, from single-rack installations to large-scale deployments. To facilitate market adoption, Accelsius has established the Accelerate Partner Program, collaborating with system integrators, OEMs, and cooling specialists across North America. A significant portion of its supply chain and manufacturing is based in North America to ensure quality control and reduce lead times. The company has secured $39.2 million in funding over three rounds, including a $24 million Series A in late 2024, to fuel international expansion and scale its operations.

Accelsius’ flagship product, NeuCool™, is a two-phase, direct-to-chip (DTC) liquid cooling platform. This technology circulates a safe, waterless dielectric refrigerant directly to cold plates mounted on high-heat components like CPUs and GPUs. The refrigerant absorbs heat and changes phase from liquid to vapor, a process that is significantly more efficient at heat transfer than single-phase liquid cooling. The vapor then moves to a control unit where it condenses back to a liquid in a closed-loop system, releasing the heat. This process allows NeuCool™ to cool over 2,200 watts per chip and up to 250kW per rack, accommodating the extreme power densities of modern AI servers. Key benefits include an estimated 50% reduction in cooling energy costs, an 80% decrease in CO2 emissions, and zero water consumption, addressing major sustainability and operational concerns for data centers.

Keywords: data center cooling, direct-to-chip cooling, two-phase liquid cooling, NeuCool, high-performance computing (HPC), AI infrastructure, thermal management, dielectric coolant, liquid cooling solutions, energy efficiency, waterless cooling, server cooling, rack density, IT infrastructure, colocation cooling, edge computing cooling, sustainable data centers, thermal resistance, enterprise cooling, compute-intensive workloads