AaltoSemi

Based in Nanjing, China, AaltoSemi operates as a developer and manufacturer of advanced packaging substrate products essential for semiconductor applications. The company was established on May 8, 2021, to address the growing demand for high-end integrated circuit (IC) substrates. The name "AaltoSemi" is inspired by the Nordic designer Alvar Aalto, reflecting a philosophy of human-centric design and service.

AaltoSemi provides comprehensive IC substrate services, from research and development to design, production, and testing. Its core product offerings include Embedded Trace Substrates (ETS), Flip Chip Ball Grid Array (FCBGA), and Antenna in Package (AiP) substrates. Specifically, the company produces high-end packaging substrates such as BT, ABF, and embedded trace substrates for flip-chip chip-scale packages (FCCSP) and FCBGA. These components are critical for the functionality of CPUs, GPUs, FPGAs, network ASICs, 5G mobile devices, and automotive electronics. The business serves a client base that requires solutions for high pin counts and superior electrical performance in products like smartphones, consumer electronics, and 5G-related applications.

The company operates from a highly automated and intelligent IC substrate production park in the Pukou Economic Development Zone in Nanjing. AaltoSemi has secured significant venture capital backing to support its growth and production line construction, with total funding reaching $82.6 million from a pool of 27 investors, including notable names like BYD Company, CTC Capital, and Gaorong Capital. The firm's business model is centered on the B2B sale of its manufactured semiconductor components. By focusing on the development and mass production of high-precision, high-reliability substrates, AaltoSemi aims to support the continuous advancement of chip design and meet the stringent quality demands of the automotive and medical sectors.

Keywords: IC substrate, semiconductor packaging, FCBGA, FCCSP, ETS substrates, ABF substrates, advanced manufacturing, circuit board components, 5G electronics, automotive semiconductors, flip-chip, B2B electronics, packaging solutions, integrated circuits, Nanjing, Pukou Economic Development Zone, high-speed computing, substrate design, AiP substrates, BT substrates